Senior EM/IR Engineer
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Some ghost-posting signals
- open for 86 days (60–89 days is elevated risk)
- 123 open roles at this company in 30 days (mass-hiring blitz)
- no salary disclosed (correlates with ghost postings)
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About the role
WHAT YOU WILL BE DOING:
Lead EM/IR drop analysis for complex SoC designs at block and full-chip levels across all process corners
Define and implement power delivery network (PDN) strategy to meet EM/IR sign-off requirements
Perform static and dynamic IR-drop analysis and work with physical design teams to implement power grid improvements
Analyze electromigration violations and develop mitigation strategies for metal and via connections
Collaborate with physical design engineers to optimize power grid density, via stacking, and decap placement
Develop and maintain EM/IR analysis flows, scripts, and automation infrastructure
Work with foundry design rules and reliability specifications to ensure sign-off compliance
Define power intent (UPF/CPF) requirements and validate implementation against power management intent
Provide power analysis results and recommendations to design leadership and cross-functional teams
Document EM/IR methodology guidelines, best practices, and sign-off reports
WHAT YOU BRING TO THIS ROLE:
Minimum 8+ years of experience in EM/IR analysis and power integrity for complex ASICs or SoCs
Hands-on proficiency with industry-standard EM/IR tools such as Cadence Voltus, Synopsys RedHawk, or equivalent
Deep understanding of power delivery network design, power grid analysis, and IR-drop mitigation techniques
Strong knowledge of electromigration physics, EM rules, and reliability analysis methodologies
Experience with both static and dynamic power analysis including vectorless and vector-based approaches
Solid understanding of low-power design techniques and their interaction with power integrity
Proficiency in scripting (Tcl, Python) for EM/IR flow development and result automation
Familiarity with advanced process node design rules and foundry reliability specifications
Excellent ability to communicate complex analysis results clearly to cross-functional teams
BONUS POINTS:
Experience with 7nm or sub-7nm EM/IR sign-off requirements
Exposure to thermal analysis and electro-thermal co-simulation
Familiarity with package-level power integrity and chip-package co-design
Experience with advanced power management architectures (DVFS, multiple voltage domains, retention)
Background in satellite communication, 5G, or high-reliability IoT chip design
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