Senior PCB Layout Engineer

What you will do

Technical Leadership

· Lead PCB layout architecture for complex multi-layer designs (10–20+ layers) including high-speed digital, RF, analog, and power circuitry

· Define and own stackups, impedance models, and via strategies (through, blind, buried, microvias, backdrilling)

· Serve as the DFM authority for layout decisions, balancing electrical performance, cost, yield, and reliability

Advanced PCB Design & Layout

· Perform and guide component placement optimizing signal integrity, power integrity , EMI/EMC, thermal, and mechanical performance

· Route high-speed serial interfaces, differential pairs, controlled-impedance nets, and sensitive RF/analog signals

· Design robust power distribution networks and grounding structures

· Apply advanced shielding and isolation techniques for EMI/EMC control

Fabrication & Assembly Interface

· Lead DFM/DFA reviews with PCB fabrication and assembly partners

· Resolve complex DFM issues related to

o HDI structures and sequential lamination

o Via consolidation, backdrilling, and drill count reduction

o Stackup optimization for yield and cost

· Optimize designs for manufacturability, reliability, and volume production

Cross-Functional Collaboration

· Work closely with electrical, mechanical, test, and manufacturing engineers throughout the product lifecycle

· Support board bring-up, debug, ECOs, and production transitions

· Mentor and technically guide junior PCB layout engineers

Documentation & Process Ownership

· Create and review stackup drawings, fabrication notes, assembly notes, and manufacturing data packages (Gerber / ODB++)

· Establish, maintain, and enforce PCB layout standards and best practices

· Drive continuous improvement in layout quality, DFM compliance, and cost efficiency

What you bring to this role

10+ years of hands-on PCB layout experience delivering complex designs from concept to production

Expert-level proficiency in PCB layout tools such as Altium Designer, Cadence Allegro

Deep understanding of:

Controlled-impedance routing and signal integrity fundamentals

Power integrity, grounding, and EMI/EMC best practices

PCB materials, stackups, and fabrication processes

HDI PCB design, advanced via structures, and manufacturing constraints

Experience with:

High-speed interfaces (PCIe, Ethernet, DDR, JESD, SERDES)

RF and mixed-signal PCB layouts

Aerospace, data center, or high-reliability hardware designs

Bonus points for the following

Bachelor’s degree in electrical engineering, Computer Engineering, or a related field (Master’s degree is a plus).

Familiarity with advanced PCB fabrication technologies such as mSAP (Modified Semi-Additive Process) and SLP (Substrate-Like PCB), including fine-line routing, small via structures, and associated DFM constraints

Working knowledge of Signal and power integrity simulation tools and DFM analysis workflows